Journal Papers

2019

  1. Huang, J.F., Yung, K.C., Li, G.J., Wei, Z.X. and Meng, Z.G., Laser-reduced zeolite imidazole framework-67 as magnetic absorbents for oil separation in water, IEEE Magnetics Letters, volume, pages 1-1, (2019). ISSN 1949-3088.

2018

  1. Yung, K.C., Xiao, T.Y., Choy, H.S., Wang, W.J., Cai,  Z.X., 2018. Laser polishing of additive manufactured CoCr alloy components with complex surface geometry. Journal of materials processing technology, 262, pp. 53-64. [Click “here” to download the paper]
  2. Wang, W.J., Yung, K.C., Choy, H.S., Xiao, T.Y., Cai, Z.X., 2018. Effects of laser polishing on surface microstructure and corrosion resistance of additive manufactured CoCr alloys. Applied Surface Science 443, pp. 167-175. [Click “here” to download the paper]
  3. Yung, K.C., Wang, W.J., Choy, H.S., Mo, X.Y., Zhang, S.S., Cai, Z.X., 2018. Laser polishing of additive manufactured CoCr components for controlling their wettability characteristics. Surface and Coatings Technology. Accepted on 9th July 2018 for publication.
  4. Subramanian, K., C.K. Chau, Yung, K.C., Relevance and Feasibility of the Existing Social LCA Methods and Case Studies from a Decision-Making perspective, Journal of Cleaner Production, vol. 171, pp. 690-703, 2018.
  5. Subramanian, K. and Yung, K.C, Modeling Social Life Cycle Assessment framework for an electronic screen product – A case study of an integrated desktop computer, Journal of Cleaner Production, 197, 417-434, June 2018.
  6. Kok, W.H., Yung, K.C., and Ang, T.C., Green gelcasting of aluminum nitride using environmental sustainable ovalbumin natural binder, Journal of the Australian Ceramic Society, Volume 55, Issue 1, pp 169-177, 2018.
  7. Kok, W.H., Cheung, K.H., Yung, K.C. and Ang, T.C., Direct gelcast3D Printing of Multi-material AlN Interposer and Mo, Journal of Engineering Research and Application, Vol. 8, Issue 9 (Part -IV), pp 25-31, (2018).
  8. Ibrahim, M.S., Yung, K.C. and Fan, J.J., Lumen Maintenance Lifetime Prediction for Phosphor-converted White LEDs with a Wiener Process based Model, Proceeding of the 20th International Conference on Electronic Materials and Packaging (EMAP2018, Hong Kong), IEEE Xplore, 17-20 Dec 2018.

2017

  1. YUNG, K.C. SUN B., JIANG, X., Prognostics-based Qualification of High-Power White LEDs Using Lévy Process Approach, Mechanical Systems and Signal Processing. Available on-line 26 May 2016 (http://dx.doi.org/10.1016/j.ymssp.2016.05.019). Vol. 82, pp. 206-216, January 2017.
  2. Huang, J.F., Yung, K.C., Meng, Z.G., Ang, T.C. and Li, G.J., Additive Manufacturing of Cobalt-based Organic Ferromagnetic Materials, IEEE Magnetics Letters, Vol. 8, p. 2104405, (2017). ISSN 1949-3088.
  3. Subramanian, K., Yung, K.C., Life Cycle Assessment study of an Integrated Desktop device – Comparison of two Information and Communication Technologies: Desktop Computers versus All-in-ones, Journal of Cleaner Production, vol. 156, pp. 828-837, 2017.
  4. Subramanian, K. and Yung, K.C., A review of life cycle assessment in Green Supply Chain Management, The international Journal of business and management (ISSN 2321-8916), Vol. 5, Issue 2, pp. 22-41, (2017).
  5. Yang, Q., Bi, Ran, Yung, K.C., Pecht, M., Electrochemically reduced graphene oxides/nanostructured iron oxides as binder-free electrodes for supercapacitors”, Electrochimica Acta, Volume 231, pp.125-134 (2017).

2016

  1. YANG, Q, PANG, S.K. & YUNG, K.C., Electrochemically Reduced Graphene Oxide/Carbon Nanotubes Composites as binder-free Supercapacitor Electrodes, Journal of Power Sources. Vol. 311, pp. 144-152, April 2016.
  2. YUNG, K.C., HUANG, J., JIN, Y., MENG, Z., CHOY, H.S., CAI, Z., LI, G., HO, C.L., YANG, J., WONG, W.Y., Photochemical Copper Coating on 3D Printed Thermoplastics, Scientific Reports., Vol. 6, p. 31188, 9 August 2016.
  3. SUBRAMANIAN, K., YUNG, K.C., Review of Life Cycle Assessment on Consumer Electronic Products – Developments and the Way Ahead, Critical Reviews in Environmental Science and TechnologyAvailable on-line 28 October 2016.
  4. YUNG, K.C., SUN, B., MENG, Z., HUANG, J., JIN, Y., CHOY, H.S., CAI, Z., LI, G., HO, C.L., WONG, W.Y., YANG J., Additive and Photochemical Manufacturing of Copper, Scientific Reports, Vol. 6, p. 39584, 21 December 2016.
  5. Kok, W.H., Yung, K.C. and Ang, T.C., Characterization of AlN Green Parts by Gelcasting with Egg-protein. Paper presented at the 2nd International Congress on Technology – Engineering & Science (ICONTES), 28-29 July, 2016, Kuala Lumpur, Malaysia, pp 168.
  6. Subramanian, K. and Yung, K.C., Social Life Cycle Impact Assessment of Desktops Considering the Use Phase, Oral presentation at EcoBalance 2016, The 12th Biennial International conference on EcoBalance-Responsible value chains for sustainability, 3-6 October, 2016, Kyoto, Japan.
  7. Ran, B., Yang, Q. and Yung, K.C., Using controllable electrochemically reduced graphene oxide (ERGO) as high-capacitance electrode material for supercapacitors, Fundamentals of Renewable Energy and Applications, Volume 6, Issue 7, pp.50 (2016). (Proceeding of International Conference on Battery and Fuel Cell Technology, December 2016, Dubai)

2015

  1. Yung K.C., Zhang,Y.Y., Chan, C.Y., “Application Guideline for Embedded GHG Emissions Database and G-BOM Analyzer”, The Hong Kong Polytechnic University (ISBN 978-988-18959-8-1), Total number of pages: 103, Jan 2015.
  2. Yung K.C., Zhang,Y.Y., Chan, C.Y., “A SME Advisory Kit for ISO/TS 14067 – Greenhouse Gases – Carbon Footprint of Products: Requirements and Guidelines for Quantification and Communication”, The Hong Kong Polytechnic University (ISBN 978-988-18959-9-8), Total number of pages: 68, Jan 2015.
  3. Yung K.C., Zhang,Y.Y., Chan, C.Y., “內置溫室氣體排放資料庫及綠色物料清單(G-BOM)估算器”, The Hong Kong Polytechnic University (ISBN 978-988-18959-8-1), Total number of pages: 100, Jan 2015.
  4. Yung K.C., Zhang,Y.Y., Chan, C.Y., “ISO/TS 14067 – 產品碳足跡量化及溝通要求及指引標準”, The Hong Kong Polytechnic University (ISBN 978-988-18959-9-8), Total number of pages: 66, Jan 2015.
  5. CHANG, M.H., SANDBORN, P., PECHT, M., YUNG, W.K.C.and WANG, W.B., “A return on investment analysis of applying health monitoring to LED lighting systems”, Microelectronics Reliability, Vol. 55, Issues 3-4, pp. 527-537, March 2015.
  6. FAN, J.J., YUNG, K.C.& PECHT, M., Predicting long-term Lumen Maintenance life of LED light sources using a particle filter-based prognostic Approach, Expert Systems with Applications, Vol. 42, Issue 5, pp. 2411-2420, April 2015.
  7. DONG, Yucheng, YUNG, Kam Chuen, MA, Ruguang, YANG, Xia, CHUI, Ying-San, LEE Jong-Min, ZAPIEN, Juna Antonio, “Graphene/acid assisted facile synthesis of structure-tuned FE3O4 and graphene composites as anode materials for lithium ion batteries”, Carbon, Vol. 86, pp. 310-317, May 2015
  8. SUN, B., PAN, W., WANG, Z. & YUNG K.C., “Envelope probability and EFAST-based sensitivity analysis method for electronic prognostic uncertainty quantification”, Microelectronics Reliability, (In Press), July 2015.
  9. GU, X. and YUNG, K.C., Ink-jet printed high conductive silver traces on polymer substrates sintered at room temperature by a camera flash lamp, Proceedings of 16thIEEE International Conference on Electrical Packaging Technology, Changsha, China, 11-14 August 2015. pp. 642-644.
  10. FAN, J.J., HE W., HENDRICKS, C., PECHT, M. and YUNG, K.C., A practical design of reliability and performance test for portable lithium-ion batteries, Proceedings of the 2015 IEEEE International Conference on Information and Automation, Lijing China, August 2015, pp. 142-147.
  11. SUN, B., LI, Y., YUNG, K.C., FENG, Q, REN, Y., Environmental Effectiveness Ontology based method for Enhancing FMEA, Proceedings of 25th European Safety and Reliability Conference (ESREL2015-Zürich), Zürich, Switzerland, 7-10 September 2015, pp.1725-1732.
  12. FAN, J.J., YUNG, K.C.& PECHT, M., Optimal design of life testing for high brightness white LEDs using the six sigma DMAIC approach, IEEE Transactions on Device and Materials ReliabilityAccepted for Publication, 23 Sept 2015.
  13. YUNG, K.C. & MUTHU, S.S., Book Chapter on Product Carbon Footprint: Case Study of a Critical Electronic Part (Subassembly of a Product)in The Carbon Footprint Handbook (Chapter 15). pp. 332-348. Editor: Subramanian Senthikannan MUTHU. Publisher: CRC Press, 533 pages.(ISBN: 978-1-48-226222-1), September 
  14. YUNG, K.C. & MUTHU, S.S., Book Chapter on Product Carbon Footprint Assessment of a Personal Electronic ProductCase study of an Electronic Scalein The Carbon Footprint Handbook (Chapter 23). pp. 502-521. Editor: Subramanian Senthikannan MUTHU. Publisher: CRC Press, 533 pages. (ISBN: 978-1-48-226222-1), September 
  15. YANG, Q, PANG, S.K. & YUNG, K.C., Dynamic high potential treatment with dilute acids for lifting the capacitive performance of carbon nanotube/conducting polymer electrodes, Journal of electroanalytical chemistryAccepted for Publication, 21 October 2015.
  16. SUN, B., HUANG, L, YE, T., YUNG, K.C., Time-variant Reliability Analysis of Ship Grillage Structure. Proceedings of 2015 the First International Conference on Reliability Systems Engineering (2015 ICRS), Beijing, China, 21-23 October 2015, paper RP-0267 (ISBN 978-1-4673-8557-2) (IEEE Catalog Number CFP15C78-ART).
  17. YUNG, W.K.C., LI, G., CHOY, H.S., CAI, Z., et.al., Eye-friendly reduced graphene oxide circuits with nonlinear optical transparency on flexible poly(ethylene terephthalate) substrates, Journal of Materials Chemistry C. Volume 3, Number 43, pp. 11259-11556, November 2015.
  18. KUSMARTSEV, F.V., WU, W.M., PIERPOINT, M.P. &YUNG, K.C., Book Chapter on Application of Graphene Within Optoelectronic Devices and Transistors in Applied Spectroscopy and the Science of Nanomaterials (in the Series of “Progress in Optical Science and Photonics Volume 2), pp. 191-221. Series Editor: Javid Atai, Book Editor: Prabhakar Misra, Publisher: Springer. 277 pages. (ISBN: 978-981-287-241-8).

2014

  1. YUNG, K.C., LIEM, H., CHOY, H.S., Thermal investigation of a high brightness LED array package assembly for various placement algorithms, Applied Thermal Engineering. Vol.63, Issue 1, pp. 105 – 118 January 2014.
  2. FAN, J.J., YUNG, K.C.& PECHT, M., Prognostics of Chromaticity State for Phosphor-converted White Light Emitting Diodes Using an Unscented Kalman Filter Approach, IEEE Transactions on Device and Materials Reliability, Vol. 14, No. 1, pp. 564-573, March 2014.
  3. FAN, J.J., YUNG, K.C.& PECHT, M., Prognostics of Lumen Maintenance for High Power White Light Emitting Diodes Using a Nonlinear Filter-based Approach, Reliability Engineering & System Safety, Vol.123, pp. 63-72, March 2014.
  4. YUNG, K.C., LIEM, H., CHOY, H.S., Heat transfer analysis of a high-brightness LED array on PCB under different placement configurations, International Communications in Heat and Mass Transfer. Vol. 53, pp. 79-86, 1 March 2014.
  5. PANG, S.K. & YUNG, K.C., Pre-requisites for achieving gold adsorption by multiwalled carbon nanotubes in gold recovery, Chemistry Engineering Science. Vol. 107, pp. 58-65, 7 April 2014.
  6. LI, Qingqian, CHAN, Y.C., ZHANG, Kaili, YUNG, K. C., Study of Microstructure Evolution in Novel Sn-Zn/Cu Bi-layer and Cu/Sn-Zn/Cu Sandwich Structures with Nanoscale Thickness for 3D Packaging Interconnection, Microelectronic Engineering, Vol. 122, pp. 52-58, 26 June 2014.
  7. XU, S., CHAN, Y.C., ZHANG, K., YUNG, K.C., Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing, Journal of Alloys and Compounds. Vol 595, pp. 92-102, 2014.
  8. YANG, Q, PANG, S.K. & YUNG, K.C., Study of PEDOT-PSS in carbon nanotube/conducting polymer composites as supercapacitor electrodes in aqueous solution, Journal of electroanalytical chemistry. Vol. 728, pp. 140-147, 15 August 2014.
  9. YANG, Q, PANG, S.K. & YUNG, K.C., Study of MWCNTS/PEDOT-PSS composites and MWCNTs/PTFE composite as electrodes for supercapacitors in aqueous solution, ECS Transactions of The Electrochemical Society. Vol. 59, No. 1, pp. 9-15, Sept 2014.

2013

  1. PANG, S.K. & YUNG, K.C., Chelating resin for removal of nickel impurities from gold electroplating solutions, Industrial & Engineering Chemistry Research, Vol. 52, No. 6, pp. 2418-2424,4 February 2013.
  2. ZHU B.L., WANG J., MA, J., WU, J., YUNG, K.C.and XIE, C.S., Preparation and properties of AIN filled epoxy composites: Effect of filler characteristics and composite processing conditions. Journal of Applied Polymer Science. 127, Issue 5, pp. 3456-34665 March 2013.
  3. YUNG, K.C., LIEM, H., CHOY, H.S., Prerequisite for maximizing thermal conductivity of epoxy laminate using filler, Journal of Materials Science: Materials in Electronics. Vol. 24, Issue 4, pp. 1095-1104, 25 March 2013.
  4. YUNG, K.C., LIEM, H., CHOY, H.S., CHEN, Z.C., CHENG, K.H. & ZAI, C.X., Laser direct patterning of a reduced-graphene oxide transparent circuit on a grapheme oxide thin film, Journal of Applied Physics.  Vol. 113, Issue 24, pp. 244903, 28 June 2013.
  5. CHANG, M.H., PECHT, M., YUNG, W.K.C., Return on investment associated with PHM applied to an LED lighting system, Proceedings of 2013 IEEE International Conference on Prognostics and Health Management. United States, 24-27 June pp.1-8.
  6. HU, X, CHAN, Y.C., ZHANG, K. & YUNG, K.C.,Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electro-migration analysis, Journal of Alloys and Compounds.  580, pp.162-171, 15 December 2013.
  7. YUNG, K.C., PANG, S.K., LEE, C.P. & TAM, S.L., Influence of photolithography on the cross-sectional shape of polysiloxane as an optical waveguide material on printed circuit boards, Journal of Electronic Materials. 42, No. 12, pp. 3494-3501, Dec 2013.
  8. YUNG, K.C., WU, W.M., KUSMARTSEV, F. & PIERPOINT F, Introduction to Graphene Electronics –A New Era of Digital Transistors and Devices, Contemporary Physics.  Vol. 54, No. 5, pp. 233-251, Dec 2013.
  9. YUNG, K.C., LIEM, H., CHOY, H.S., Heat dissipation performance of high brightness LED package assembly using high thermal conductivity filler, Applied Optics. Vol.52, No. 35, pp. 8484-8493, 10 December 2013.
  10. YUNG, K.C., Book Chapter on  Green PCB manufacturing technologies in  Springer Handbook of Sustainable Engineering. pp. 301-322. Editors: Kun-Mo Lee & Joanne Kauffman. Publisher: Springer  1298 pages. (ISBN: 978-1-4020-8938-1), 2013.

2012

  1. YUNG, K.C., LAW, C.M.T., LEE, C.P., CHEUNG, B and YUE, T.M., Size control and characterization of Sn-Ag-Cu lead-free nano-solders by chemical reduction process, Journal of Electronic Materials.Volume 41, Number 2, pp. 313-321, February 2012. 
  2. YUNG, K.C., CAI, Z.X. & CHOY H.S., Selective patterning and scribing of Ti thin film on glass substrate by 532 nm picosecond laser, Applied Physics A-Materials & Processing, 107, Issue 2, pp. 351-355,May 2012.
  3. FAN, J.J. and YUNG, K.C., Comparison of Statistical Models for the lumen Lifetime Distribution of High Power White LEDs, Proceedings of 2012 Prognostics & System Health Management Conference (PHM-2012 Beijing), Beijing China, May 2012. pp. 1-5.
  4. Yung K.C., “Laser dicing technology for ultrathin touch panel/LCD glass”, The Hong Kong Polytechnic University, Total number of pages: 75, May 2012.
  5. YUNG, W.K.C.,CHAN, H., SO, H.T., WONG, W.C., CHOI, A.C.K. & YUE, T. M, Environmental Impact of Two Electrical Products with reference to the Energy-Using Products Directive, International Journal of Sustainable Engineering, Vol. 5, No. 2, pp. 86-90, June 2012.
  6. YUNG, W.K.C., CHAN, H., WONG, W.C., SO, H.T., CHOI, A.C.K. & YUE, T. M, Eco-redesign of a Personal Electronic Product subject to the Energy-Using Product Directive, International Journal of Production Research, Vol. 50, No. 5, pp. 1411-1423,June 2012.
  7. FAN, J.J., YUNG, K.C.& PECHT, M., Life estimation of high power white LED using degradation data driven method, IEEE Transactions on Device and Materials Reliability, Vol. 12, No. 2, pp. 470-477, June 2012.
  8. SHARIF, I., WONG, N.B., CHAN, Y.C., and YUNG, W.K.C.,Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy, Journal of Materials Science: Materials in Electronics, Vol. 23 (7), pp. 1427-1434. 2012
  9. HUANG, S.Q., YUNG, K.C.& SUN, B., A Finite Element Model and Experimental Analysis of PTH Reliability in Rigid-Flex Printed Circuits Using the Taguchi
    Method, International Journal of Fatigue, Vol. 40, pp 84-96, July 2012. 
  10. PANG, S.K. & YUNG, K.C., A green approach to synthesis of nano-particles of Sn-3.0Ag-0.5Cu Lead-Free solder alloy, Materials Transactions, Japan Institute of Metals, Vol. 53, No. 10, pp. 1770-1774,October 2012.
  11. FAN, J.J. and YUNG, K.C., PECHT, M., Anomaly Detection for Chromaticity shift of high power white LED with mahalanobis distance approach, Proceedings of14th International Conference on Electronic Materials and Packaging, EMAP 2012, Hong Kong, 13-16 December 2012. pp. 1-5.
  12. YUNG, K.C., LIEM, H.M., CHOY, H.S., Thermal performance and placement design of LED array package on PCB, Proceedings of14th International Conference on Electronic Materials and Packaging, EMAP 2012, Hong Kong, 13-16 December 2012.

2011

  1. YUNG, K.C., Book Chapter on  Green PCB manufacturing technologies in  Springer Handbook of Sustainable Engineering. pp. 301-322. Editors: Kun-Mo Lee & Joanne Kauffman. Publisher: Springer  1298 pages. (ISBN: 978-1-4020-8938-1), 2013.
  2. FAN, J.J. and YUNG, K.C. & PECHT, M, Failure Modes, Mechanisms, and Effects Analysis for LED Backlight Systems used in LCD TVs, Proceedings of IEEE Prognostics & System Health Management Conference 2011 (PHM-2011 Shenzhen),  Shenzhen China, 24-25 May 2011. pp. 1-5.
  3. YUNG, K.C., LIEM, H., CHOY, H.S. & LUN W.K., Degradation mechanism beyond device self-heating in high power light-emitting diodes, Journal of Applied Physics 109, Issue 9, pp.094509-1-094509-6, 13 May 2011.
  4. GAIN, A.K., CHAN, Y.C., YUNG, W.K.C.,Microstructure thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO(2) composite solder on flexible ball grid array substrates, Microelectronics Reliability.  51, Issue 5, pp. 975-984, May 2011.
  5. YUNG K.C. & CHEN, C. & LEE, C.P., Laser induced activation of circuit lines and via-holes on AlN for electroless metal plating, Applied Surface Science, Vol. 257, Issue 15, pp.6601-6606, May 2011.
  6. Yung,C., Liem, H.M., Choy H.S., “Cost-effective, High-efficient Heat Dissipation PCBs for High-brightness LEDs”, The Hong Kong Polytechnic University (ISBN 978-962-86893-0-9). Total number of pages: 109, July 2011.
  7. FAN J.J., YUNG K.C., & PECHT, M., Physics-of-Failure based Prognostics and Health Management for High Power White Light-emitting diode Lighting, IEEE Transactions on Device and Materials Reliability, Vol. 11, No. 3, pp.407-416, September 2011.
  8. CAI, Z.X.,YUNG, K.C. and ZENG, X.Y., Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering, Applied Surface Science, Volume 258, (1) pp. 478-481, October 2011
  9. YUNG, K.C., Book Chapter on Inkjet Printingfor the Book: Maskless Functional Printing. Editors: J.W. Jillek & Ansorge. Publisher: Leuze Company, Germany. November 2011.
  10. YUNG, W.K.C., MAN, Y.W. and LIEM, H.M., Correlating Interconnect Stress Test and Accelerated Thermal Cycling for Accessing the Reliabilities of High Performance Printed Circuit Boards, IEEE Transactions on Advanced Packaging. 1, No. 12, pp. 2005-2017, December 2011.
  11. GAIN, A.K., CHAN, Y.C., YUNG, W.K.C.,Effect of additions of ZrO(2) nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metalized Cu pads, Microelectronics Reliability.  51, Issue 12, pp. 2306-2313, December 2011.
  12. SUN, S.J., ZHU, J.J., YUNG, K.C.,Studied on the microfluidic chip based on the kapton by excimer laser ablation, Key Engineering Materials, Volume 458, December 2011, Pages 81-86.
  13. Yung K.C., Lee C.P., Pang, S.K., “Development of nanosolder for low temperature Pb-free electronic interconnect applications using a modified polyol process”, The Hong Kong Polytechnic University (ISBN 978-988-18959-1-2). Total no. of pages: 81, December 2011.

2009

  1. YUNG, K.C., ZHU B.L. & YUE, T.M. & XIE, C.S, “Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites”, Composites Science and Technology. Volume 69, Issue 2, February 2009.

2008

  1. YUNG K.C., WANG J. and YUE, T.M., “Thermal Management for Boron Nitride Filled Metal Core Printed Circuit Board”,Journal of Composite Materials. Vol. 42, No. 24, pp. 2615-2627, December 2008.
  2. YUNG K.C., WU, S.P. and LIEM, H., “Synthesis of submicron size silver powder for metal deposition via laser sintered inkjet printing”. Journal of Composite Materials. Accepted for publication, Nov 2008.

2007

  1. YUNG, K.C., WANG J and YUE, T.M., Surface characterisation of pre-treated copper foil used for PCB lamination. Journal of Adhesion Science Technology, Vol. 21, No.5-6, pp.363-377, April 2007.
  2. LEE, J.H.F., CHAN, C.Y., YUNG, K.C., TANG, J.C.S. and JAYANT, A, “Development of embedded passives in PCBAs”, Proceedings of National Conference on Design, Dynamics and Manufacturing (NCDDM-2007), India, 16-17, March, 2007, pp.325-331.
  3. YUNG, K.C. and ZHU, J.J., Studies on laser ablation of low temperature co-fired ceramics (LTCC), Microelectronics International. Vol.24, Number 3, pp. 27-33, July/August 2007.
  4. YUNG, K.C., ZHU, B.L., YUE, T.M., XIE, Z.S. and WU, J, Effect of AlN Content on The Performance of Brominated Epoxy Resin for Printed Circuit Board (PCB) Substrate, Journal of Polymer Science Part B: Polymer Physics Vol. 45, Issue 13, 1662-1674, 1st July 2007.
  5. YUNG K.C., WU J. and YUE, T.M., Nd:YAG laser drilling in Epoxy Resin/AlN composite material, Composites Part A: Applied Science and Manufacturing. Volume 38, Issue 9, pp. 2055 – 2064, September 2007.
  6. HUANG, S.Q. and YUNG, K.C., Reliability comparison of rigid flex printed circuit (RFPC) using various materials and design build-ups, Industrial Engineering Research. Vol. 4 (2), pp.103-112, September 2007.
  7. YUNG, K.C. and LIEM, H.M., Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing, Journal of Applied Polymer Science. Volume 106, Issue 6 , pp 3587 – 3591, 15 Dec 2007.

2006

  1. YUNG, K.C., WU, J. & YUE, T.M., Size Effect of AIN on the Performance of Printed Circuit Boards (PCBs) Materials, Journal of Composite Materials. Vol. 40, No. 7, pp. 567-581, April 2006.
  2. ZHANG, B. and YUNG, K.C. Quality and reliability of fine lines fabricated by laser structuring technique, Industrial Engineering Research, Vol. 3, No. 1, pp.10-19., May 2006.
  3. ZHANG, B. and YUNG, K.C., Feasibility of the 248 nm Excimer laser in laser structuring of fine circuit lines on Printed Circuit Board. The International Journal of Advanced Manufacturing Technology, Vol. 33, pp. 1149-1158, December 2006.
  4. YUNG, K.C., WANG, J., Modeling Young’s Modulus of Polymer Layered Silicate Nanocomposites Using a Modified Halpin-Tsai Micromechanical Model. Journal of Reinforced Plastics & Composites. Vol. 25, No. 8, 847-861, May 2006.
  5. FANG X.Y & YUNG, K.C., Copper direct drilling with TEA CO2 laser in manufacture of high-density interconnection Printed Circuit Board, IEEE Transactions on Electronics Packaging Manufacturing. Vol. 29, No.3, pp. 145-149, July 2006.
  6. YUNG, K.C., WANG, J., S.Q. Huang, C.P.Lee and YUE, T.M., Modelling the etching rate and uniformity of plasma-aided manufacturing using statistical experimental design. Journal of Materials and Manufacturing Processes. Vol. 21, pp.1-8, Oct. 2006.
  7. YUNG, K.C., WANG, J. And YUE, T.M., Fabrication of Epoxy-Montmorillonite Hybrid Composites used for Printed Circuit Board via in-situ Polymerization, Advanced Composite Materials, Vol. 15, No. 4, pp. 371-384, October 2006.

2005

  1. JILLEK, W. and YUNG, K.C., Embedded components in PC Board: A processing technology review. The International Journal of Advanced Manufacturing Technology, Vol. 25, No. 3-4, pp.350-360, February 2005.
  2. YUNG, K.C., Zhu, H.H. & YUE, T.M., Theoretical and experimental study on the Kerf Profile of the Laser Micro-cutting NiTi Shape Memory Alloy using 355 nm Nd:YAG. Smart Materials and Structures, Vol.14, 337-342, 2005.
  3. YUNG, K.C., MEI, S.M. & YUE, T.M., Pulsed UV laser ablation of Liquid Crystal Polymer. The International Journal of Advanced Manufacturing Technology, 2004. (Published on-line dated 12 January 2005)
  4. LI, H.H., Chan, Q. Y. and YUNG, K.C., A study on the developments of embedded passive components in PCBA. Science Journal of Northwest University Online, Vol. 3, No. 1, pp.122-128, June 2005.
  5. ZHANG, B. and YUNG, K.C., Frequency-tripled Nd:YAG laser ablation in laser structuring process, Optics and Lasers in Engineering, Vol. 44, Issue 8, pp. 815-825, August 2005.
  6. CHAN, Q.Y. & YUNG, K.C., Investigation of thermal characteristics of embedded resistors, Journal of Electronic Components and Materials, Vol. 24, No. 12, pp.61-63, December 2005.

2004

  1.  LEUNG, E.S.W, YUNG, W.K.C. and LEE, W.B., A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of Printed Circuit Board, The International Journal of Advanced Manufacturing Technology, Vol. 24, pp. 474-484, 2004. (Published on-line 7 April 2004)
  2.  LEUNG, E.S.W. and YUNG, W.K.C., Quality and reliability of high aspect-ratio blind microvias formed by laser-assisted seeding mechanism in PCB, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No.2, pp.1-10, 2004.
  3. YUNG, K.C., MEI, S.M. & YUE, Rapid prototyping of polymer-based MEMS devices using UV YAG laser, Journal of Micromechanics and Micro-engineering, Vol. 14, pp.1682-1686, 2004. (published on-line dated 15 September 2004).

2003

  1. ZENG, D., YUNG, K.C. and XIE, C.S., Near threshold UV-laser ablation of Kapton film investigated by X-ray photoelectron spectroscopy. Journal of Materials Research, Vol. 18, No.1, pp.53-59, January 2003.
  2. CHAN, T.H., YUNG, W.K.C. & MOK, A.K.S., Application of Value Delivery System (VDS) and Performance Benchmarking in Flexible Business Process Reengineering. International Journal of Operations and Production Management. Vol. 23, No. 3, pp. 300-315, 12 March 2003.
  3. YUNG, K.C., CHAN, K.C., YUE, T.M. and YEUNG, K.F., The effects of pulse plating parameters on copper plating distribution of microvias in PCB manufacture, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No.2, pp. 106-109, April 2003.
  4. ZENG, D.W. & YUNG, K.C., UV Nd:YAG laser ablation of copper: chemical states in both crater and halo studied by XPS. Applied Surface Science, Vol. 217, Issue 1-4, pp.170-180, 15 July 2003.
  5. YUNG, K.C., CHEN, G.Y. & LI, L.J., Laser dressing of Resin Bond CBN wheels by Q-switched Nd:YAG laser, The International Journal of Advanced Manufacturing Technology. Vol. 22, pp. 541-546, 19 July 2003 published on-line.
  6. YUNG, W.K.C, CHAN, K.C., YUE, T.M. & YEUNG, K.F., The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture. The International Journal of Advanced Manufacturing Technology, 2003. Vol. 23, No.3-4, pp. 245-248, 18 December 2003 (published on-line). Feb 2004 (hard copy).

2002

  1. CHEN G.Y., XIE, X., Li, L, LIU, J. and YUNG K.C., Recent development of Laser dressing of super-abrasive wheels, Diamond and Abrasives Engineering, Vol. 128, No.2, February 2002.
  2. YUNG, K.C., (Mei, S.M.) & YUE, T.M., A study of heat affected zone in UV YAG laser drilling of GFRP materials. Journal of Materials Processing Technology, Vol. 122, Issues 2-3, pp. 278-285, 28 March 2002.
  3. (ZENG, D.), YUNG, K.C. & (XIE, C.S.), XPS investigation of the chemical characteristics of Kapton films ablated by a pulsed TEA CO2 laser. Surface and Coatings Technology, Vol. 153 Issue 2-3, pp. 210-216, 15 April 2002.
  4. LI, K, ZENG, D.W., YUNG, K.C., CHAN, H.L.W. and CHOY, C.L., Study on ceramic/polymer composite fabricated by laser cutting, Materials Chemistry and Physics, Vol. 75, pp. 147-150, 28 April 2002.
  5. (ZENG, D.W.), (XIE, C.S.) and YUNG, K.C., Investigation on laser surface alloying of copper on high nickel austenitic ductile iron, Material Science and Engineering A. Vol. 333, Issues 1-2, pp. 223-231, August 2002.
  6. CHAN, T.H., YUNG, K.C., MOK, A.K.S. and LEE, W.B., Application of benchmarking in Flexible Business Process Reengineering, Benchmarking-An International Journal, Vol. 9, No. 1, 2002.
  7. YUNG, K.C., ZENG, D. & YUE, T.M., High repetition rate effect on the chemical characteristics and composition of Upilex-S polyimide ablated by UV Nd:YAG laser. Surface and Coatings Technology, Vol. 160 (1), pp. 1-6, Oct 2002.
  8. ZENG, D., XIE, C.S. and YUNG, K.C., Meso-structured composite coating on SAE 1045 carbon steel synthesized in situ by laser surface alloying. Materials Letters, Vol. 56 (5), pp. 680-684, October 2002.
  9. FANG, X., YUNG, K.C. WU, M.T. and XI Y., Ferroelectric fatigue versus electronic structure of lead Titanium Perovskite system, Ferroelectrics, Vol. 281, pp. 163-169, December 2002.
  10. ZENG, D.W., Li, K., YUNG, K.C., CHAN, H.L.W., CHOY, C.L. and XIE, C.S., UV laser micro-machining of piezoelectric ceramic using a pulsed Nd:YAG laser, Applied Physics A: Materials Science and Processing, Vol. 75, pp.1-7, December 2002. (published on-line)

2001

  1. ZENG, D., XIE, C., HU, Q. and YUNG, K.C., Corrosion resistance enhancement of Ni-resist ductile iron by laser surface alloying. Scripta Materialia, Vol. 44, Issue 4, pp.651-657, 20 March 2001.
  2. ZENG, D, YUNG, K.C. and XIE, C., Investigation of corrosion behavior of high nickel ductile iron by laser surface alloying with copper. Scripta Materialia, Vol. 44, Issue 12, pp. 2747-2752, 8 June 2001.
  3. YUNG, K.C., ZENG, D., Laser ablation of Upilex-S polyimide: influences of laser wavelength on chemical structure and composition in both ablated area and halo. Surface and Coatings Technology, Vol. 145, Issues 1-3, pp. 186-193, 1 August 2001.
  4. ZENG, D.W. & YUNG, K.C., XPS investigation on Upilex-S Polyimide ablated by pulse TEA CO2 Laser. Applied Surface Science, Vol. 180, Issues 3-4, pp.280-285, 16 August 2001.
  5. ZENG, D, YUNG, K.C. and XIE, C., Enhancement of corrosion resistance of high nickel austenitic ductile iron by laser surface treatment, Lasers in Engineering, Vol. 11, Issue 2, pp. 133-141, October 2001.
  6. LEUNG, E.S.W. and YUNG, W.K.C., Copper thickness and thermal reliability of microvias produced by laser-assisted seeding (LAS) process in Printed Circuit Board manufacture, Asian Journal on Quality, Vol. 2. No. 2, pp. 69-92, December 2001.

2000

  1. YUNG, K.C., Man, H.C., YUE, T.M. & (Liu, J.S.), 355nm Nd:YAG laser ablation of polyimide and its thermal effect. Journal of Materials Processing Technology, Vol. 101, Issues 1-3, pp.306-311, 14 April 2000.
  2. YUNG, K.C., Man, H.C., YUE, T.M. & (Liu, J.S.), 355nm Nd:YAG laser ablation of polyimide and its thermal effect. Journal of Materials Processing Technology, Vol. 101, Issues 1-3, pp.306-311, 14 April 2000.

1999

  1. YUNG, K.C., MAN, H.C., & (Liu, J.S.), Experimental Investigation of 355nm Nd:YAG laser ablation of RCC in PCB. Journal of the Institute of Circuit Technology, Vol. 25, Issue 3, pp. 13-17, April 1999.