• Advanced Manufacturing Technology
  • Rigid Flex Manufacturing
    • Process Characterization and Reliability in Rigid Flex Printed Circuit (RFPC) Manufacture
  • Microvia Drilling and Laser Dicing
  • Fine-line Circuit Patterning
    • Laser-sintering of Printed Circuit board
    • Laser structuring of ultra-fine line in Printed Circuit Board fabrication
  • Microvia Metallisation and Electroplating
  • Embedded Passives and Design Area
    • Development of Embedded Passive PCB and Electronic
    • Integration of embedded capacitors and resistors in multi-layer Printed Circuit Board
    • Selective laser processing of Ink-jet printed nano-scaled particles for embedded passive components
    • Low voltage-high impedance flying probe tester system for detecting embedded components in printed circuit boards
    • Development of manufacturing technology for printed circuit board with embedded resistor components
  • Quality and Reliability
  • Environmental
    • Supporting Industries to Achieve Readiness for the Imminent European Union’s Regulation (REACH) (SME Funded Project)
    • An Integrated Environmental Product Assessment Model on Ecodesign for Electrical Products and Electronic Appliances
    • Development of an ecodesign tool box and the conformity assessment methodologies for the CE marking requirement (2005/32/EC) of the Energy Using Products (EuPs) export to EU market (SME Funded Project)
    • Development of an embedded Greenhouse Gas (GHG) emissions database with a G-BOM analyzer and a SME advisory kit for electrical and electronic industries to respond to the implementation and compliance of ISO 14067 (SME Funded Project)
    • Enhancing the Environment, Health and Safety (EHS) Awareness of the WEEE Recycling Industry in HK (SME Funded Project)