Printed Circuit Board Fabrication – Clip Art Graphics

ThisCD-ROM contains 100 electronic images of computer graphics created for IPC training videos, suitable for use on PC and Machintosh systems. Full color TIF files at 640 x 480 resolution provides high quality illustrations of single-sided, double-sided and multilayer fabrication sequences (copper only, pattern plate, & print and etch processes). Additional illustrations include typical board defects and causes. These images can be used for internal educational purposes, including technical documents and presentations, multimedia programs, workmanship standards, etc. They may not be resold individually or incorporated into any products for resales.


The National Technology Roadmap for Electronic Interconnections 2000/2001
The National Technology Roadmap provides vision and direction for product development, process development and services required to satisfy the current and future needs of companies who are building electronic equipment in the U.S. The Roadmap presents findings and recommendations based on OEM requirements and a new cost model that considers circuit density (for board fabrication) and assembly complexity (for assembly manufacture). The Roadmap encompasses the supply chain infrastructure needed for single chip and multichip
packaging, printed board issues, assembly considerations, optoelectronics and related management/environmental key pressure points. Each chapter contains specific recommendations addressing short-term, near-term and long-term requirements, proposed actions and opportunities.

IPC Printed Circuits Expo 2001

Contains (105) 35 mm slides used in Basic Multilayer Fabrication.  Includes computer graphics, and sample microphotographs at each process step, to review the contents of the video, or create / supplement your own training program.

Desk Reference Manuals Demo

Included on this CD-ROM are four .pdf formatted files, each containing one Desk Reference Manual (DRM) for sample review.
The part numbers and titles for these manuals are as follows:
IPC-DRM-40 : Through – Hole Solder Joint Evaluation
IPC-DRM-SMT : Surface Mount Solder Joint Evaluation
IPC-DRM-53 : Introduction to Electronics Assembly
IPC-DRM-18 : Component Identification

Proceedings of the Technical Conference at IPC Annual Meeting (9-13 October 2001)

The imppending restriction on the use of lead begs the question of workmanship quality for lead-free finished board assembly solder joints. Real estate for surface mounted passive devices is evaporating as the drive for shrinking circuit geometries marches on. The ever-present push for high-density packages continues to force companies into meeting unique challenges for fine pitch, and the emerging field of optical electronics offers the potential to redefine the face of PCBs forever. The IPC Annual Meeting 2001 assembled the best from around the globe to help companies “see the light” with 37 technical paper presentations. This item is only available in .pdf electronic format. Released October 2001

IPC Printed Circuits Expo 98 Proceedings

IPC Printed Circuits Expo is the premier technical conference and trade show for the printed circuit industry which is summarized in the proceedings. It includes over 80 technical papers covering printed wiring board manufacture, assembly and design presented at the event. Released in April 1998.

IPC Printed Circuits Expo 2000 Proceedings

IPC Printed Circuits Expo is the largest exhibition in North America focused exclusively on the printed circuit industry. These proceedings include 65 papers from 16 sessions. Released in April 2000.

IPC Printed Circuits Expo 2002 Proceedings

IPC Printed Circuits Expo is the premier technical conference and trade show for the printed wiring board manufacturing industry. A world-class technical conference is summarized in the Proceedings volume. It includes 66 technical papers covering printed wiring board materials, manufacturing and design presented at the event.  Released in March 2002.

IPCWorks 2000 Proceedings

Sweating over the “hot air” that’s blanketing discussions on alternative surface finishes? Stumbling down the “green path” of lead elimination? Fear not! Industry experts converged on Miami, Florida in September 2000 to offer attendees of the IPC national Conference solutions to solderability, and now you too can reap the benefits of their findings with the release of IPCWorks 2000 Proceedings. Twenty-one papers from experts in Europe, Japan and the U.S. help guide you through lead-elimination research and alternate surface finishes, including nickel-gold, tin and OSP, to name a few.

IPC and JEDEC International Conference on: Lead-Free Electronic Components and Assemblies

Public and political pressure against lead continues to grow, expecially outside of the U.S., Japan, Denmark and the European Union (EU) are all proposing bans on lead and products containing lead. A ban in Europe will have have an effect in the global marketplace, which will force many U.S. manufacturers to eliminate lead. Many challenges still exist and the path forward to success is not one of consensus. Companies need to stay aware of the hot issues remaining in order to focus efforts that will allow success to be achieved by 2006-7. This international conference, held in May 2002, brought 26 speakers from 5 countries – Germany, Japan, U.K., Canada and the U.S. – together for a real-world look at lead-free solder developments.

ICT Annual Symposium Niche Manufacturint (1st May 2002)

These proceedings are from the Annual Symposium which took place on the 1st May 2002.  They include the following presentations:
– Lithographic Techniques applied to PCB Manufacture
– The Development Tsunami – Overview
– Surface Coatings to enable Fluxless Soldering of Copper Substrate
– Flexible Hybrid Circuitsv – a Unique Solution to an Old Problem
– HDI Development
– PTFE PCB Manufacture
– Reliability Testing in Niche Manufacturing
– Piezoelectric Inkjet Printing applied to PCB Fabrication Processes
– Update on Latest Multilayer Capability

ICT Annual Symposium 2001 – A Space Odyssey (2nd May 2002)

These proceedings are from the Annual Symposium which took place on the 2nd May 2002.  They include the following presentations:
– Considerations in the production of very large format backplanes
– A Dream Realisation
– Integrated Passives in Advanced Printed Wiring Boards
– Circuit Fabrication with Conductive Lithographic Centre
– “PRIME”: A New Environmentally Friendly High Density Interconnect Process
– Thermal Effects of Embedded Passive Components
– Prototype PCBs in Hours with additive copper polymer technology
– Technology for the Future

IPC Printed Circuits Expo 1999

IPC Printed Circuits Expo is the premier technical conference and trade show for the printed wiring board manufacturing industry, which is summarized in the proceedings. It includes over 80 technical papers covering printed wiring board manufacture, assembly and design presented at the event.


IPC 2nd International Conference on Optoelectronics: At the Speed of Light Proceedings (12-13 June 2002)

Photonic signals carry ten million times as much information as electronic. Light not only has a much higher frequency than electronic signals, it is divisible into numerous wavelengths, each carrying separate data on a single strand of glass fiber. Beyond signal speed and density, the mechanical and sensory attributes of photons enable integrated components to do much more.

Electronic Circuits World Convention 9 (7-9 October 2002)

Europe has the honour to host the Electronic Circuits World Convention (ECWC9). This world leading conference for the packaging and interconnection industry will be held alongside EPC2002. This combination offers a high-level conference programme in conjunction with the major trade show EPC2002.


Joint Industry Standard – Performance Standard for Ball Grid Array Balls

This standard, developed jointly by IPC an dthe Electronic Industries Association (EIA), establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications, ranging from highest reliability computer, space and military applications to disposable commodity applications. Released June 2002.


Design Guide for RF/Microwave Circuit Boards

This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements.


National Conference on Next Generation Interconnecting and the Hole Truth of High Density Interconnects

Between the business and technology challenges of optoelectronics, the use of 2D/3D Multichip Packaging in today’s high density arena and the surface finishes that stand ready to replace HASL, the IPC’s 2002 Annual Meeting assembled technology leaders from around the globe to help you review new technologies that promise to redefine the PCB and electronic assembly industries. Includes 27 technical papers addressing these issues as well as embedded passive components, solderability and build-up technology.


Seminar on New Manufacturing Technologies for Electronics Miniaturization (25 January 2003)

“Ionic Migration” (also known as electrochemical migration) refers to a phenomenon in which metal ions are transferred from one metal electrode to the opposite metal electrode. This process results in metal or alloy deposits. The transfer occurs between the electrodes of devices such as Printed Circuit Boards (PCBs) when an electric field is applied in the presence of moisture and dew condensation between the electrodes.
Migration is classified as either dendrite or Conductive Anodic Filament (CAF) depending on the shape of the deposits and the conditions leading to the occurrence. “Dendrite” refers to dendritic-shaped metal or metal-oxide deposits on the surface of PCB insulation. “CAF” refers to metal or metal-oxide deposits in the shape of elongated fibers deposited along the glass fibers of the interior of the PCB insulation panel.
There are three processes leading to migration: (1) anodic reaction (metal dissolution), (2) cathodic reaction (metal-oxide deposits), and (3) inter-electrode reaction (metal oxide deposits). Reactions (1) and (2) are mechanisms leading to dendrite formation. Metal dissolving at the anode (positive electrode) is deposited on the cathode (negative electrode). These dendrites consist of pure metal or metal oxide deposits growing toward the cathode, and result in short circuits between the electrodes. Reactions (1), (2), and (3) are all thought to be mechanisms leading to CAF formation. Metal dissolving at the anode results in metal or metal -oxide deposits between the electrodes and the growth of these deposits results in short circuits between the electrodes. The speed of growth is affected greatly by the characteristics of the materials.
In this seminar, the ionic migration generation process and the reliability test method of copper and solder alloys on PCBs will be explained


APEX Technical Conference

IPC SMEMA Council APEX Conference is the leading conference for electronics manufacturing, test, and printed circuit assembly. These proceedings from APEX 2003 include 126 pages from 42 sessions, with tracks focusing on lead free, test and inspection, and electronics assembly. The sessions included advanced technology, life cycle, quality, process control, materials and solderability, and EMS management, business and supply chain issues. In addition to all the papers, the CD also includes the PDFs of 31 actual presentations form the sessions. All papers on the CD are electronically searchable by title, author and subject. Released April 2003.


IPC’s International Conference on Embedded Passives

“The Faster and Cleaner Electronic Signals for the Future”
Reducing the size and complexity of circuit boards is essential for companies to meet market demand. In major product sectors, passive resistors and components represent a significant fraction of the solder joints, consume almost half the surface area and account for the majority of the component placements. Embedded passives technology can allow significant reduction in the number of these surface passives. An enabling technology for the electronics industry, for North American PCB manufacturers its implementation can provide significant product and service differentiation from offshore competitors. This international conference held June 2003 brought together speakers from Japan, Finland, Singapore, Taiwan and the United States to address this critical new technology.


Acceptability of Printed Boards

The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 80 new or revised photographs and illustrations, revision G provides new coverage on topics such as smear removal, lifted lands and wire bond pads along with updated and expanded coverage for measling and crazing of printed boards, annular ring requirements, etchback, foil cracks, flexible circuits, and minimum foil thickness for conductive patterns. The document sychronizes to the acceptability requirements expressed in IPC-6012B and IPC-6013A. 140 pages. Released July 2004.


Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. Addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision B incorporates many new requirements in areas such as surface finishes, hole size and pattern feature accuracy, annular ring and breakout conditions, surface mount defects for BGA and wire bond pads, minimum internal and external copper thickness and requirements for thermal stress testing. This revision synchronizes to the IPC-A-600G. For use with IPC-6011. Supersedes IPC-6012A with Amendment 1. 56 pages. Released August 2004